- Projecting of PCBs and designing of electronic modules and units 
- Development of construction documentation. 
- Development and manufacturing of metal housings and other parts. 
- Modifying of standard plastic housings. 
- Completing the products with electronic components including PCBs. 
- PCBs assembling: 
 
                
                  size up to 560*230 mm (for assembling with FRITCH PA600 automate);
                  chips from 0201;
                  packaged ICs of BGA, QFP etc types, size up to 45*45 with the pitch from 0,3 mm;
                  connectors with solder and press-fit installation.
                    
- Assembling of electronic units including leak-tight. 
- Assembling of wire bundles and cables. 
- Functionality checking and testing of electronic modules and units. 
- Production testing for climatic affections (in ESPEC MC711T climatic camera from -70°Ñ to + 150°Ñ with max. size of 400 õ 400 õ 400 mm). 
- Packing of ready products for surface and air transportation.