Projecting of PCBs and designing of electronic modules and units
Development of construction documentation.
Development and manufacturing of metal housings and other parts.
Modifying of standard plastic housings.
Completing the products with electronic components including PCBs.
PCBs assembling:
size up to 560*230 mm (for assembling with FRITCH PA600 automate);
chips from 0201;
packaged ICs of BGA, QFP etc types, size up to 45*45 with the pitch from 0,3 mm;
connectors with solder and press-fit installation.
Assembling of electronic units including leak-tight.
Assembling of wire bundles and cables.
Functionality checking and testing of electronic modules and units.
Production testing for climatic affections (in ESPEC MC711T climatic camera from -70°Ñ to + 150°Ñ with max. size of 400 õ 400 õ 400 mm).
Packing of ready products for surface and air transportation.